Description for our service
Our goal is to improve your operational readiness and reduce life-cycle costs by being the accredited die-banking source for your parts. We improve your logistics, manage obsolescence and reduce lead-times for the availability of your end-of-life products.
We tailor our parts management program according to your schedule, budget, and product demand. With die banking, we acquire wafers from semiconductor manufacturers and store them in a temperature controlled environment. When the chips are needed, we build the devices per OEM specs, perform lengthy qualification tests and other requirements based on the date codes of the material.
Capabilities at a Glance
Freequently Asked Question
Any question you may have, feel free to ask us, or maybe you can find answers in one of the following questions.